1) FPC process: Flex Board Cutting→Drill Locating Hole→Image→AOI→Cover Film→Lamination
2) Rigid PCB: Rigid Board Cutting→Drill Locating Hole→Rigid Board Pre-treatment
3)Main process: Rigid-Flex Fusion→Drilling→PTH→Outer Layer→Outer Layer AOI→Solder Mask→Finishing→Screen→Gong Open Lid→Routing→E-Tes→FQC→Packaging
Rigid-flex board structure: high multi-layer symmetrical structure
This structure can realize high multi-layer, high thickness-to-diameter ratio, multi-layer impedance design, wide application, and industrial control design.
High-frequency materials are used in DuPont AP9141, the copper thickness of the flexible board substrate is 1OZ, and the impedance is matched. The impedance of the flexible board area is different from that of the rigid board area. The dielectric impedance process provides stable impedance signal transmission.
High multi-layer lamination, high-precision CCD pin less combination alignment, interlayer accuracy up to 25um, with the browned copper surface treatment process, providing good interlayer accuracy and pressure bonding force.
NF PP and high TG flow glue PP mixed press process, using special laminated structure, polymer plastic material, and metal thin to provide good board surface flatness and bonding force.
Dense BGA, minimum 0.25mm, solar black ink application, and parallel light machine processing with solder mask, to achieve product design confidentiality and good BGA quality.
The metal groove on the side is patterned and etched after electroplating. This process provides a good appearance and quality of the metal tank.
Lid opening method: laser counter control + mechanical forward control. High-precision mechanical control depth to achieve good
The appearance of the combination of rigid and flexible positions.
Multi-group differential, single-ended impedance design, impedance control 8%, professional impedance simulation design.
Realize the impedance design of the difference between the flexible board area and the rigid board area dielectric layer.